Ribbon is one of the least expensive items on a module bill of materials and one of the most capable of causing trouble. It carries current out of every cell and holds the string together mechanically.
Dimensions are a balancing act
Wider or thicker ribbon lowers resistive loss but shades more of the cell and stiffens the string. Narrower ribbon reduces shading and raises resistance.
The correct dimension is a function of the cell layout and busbar design, not a universal number.
Coating and soldering behaviour
The coating determines how reliably the ribbon wets during soldering and how the joint ages afterwards. Inconsistency here shows up as yield loss on the stringer and as field failures years later.
Stable soldering behaviour across deliveries is often worth more than a marginal price advantage.
Mechanical stress on the cell
Ribbon and cell expand at different rates. As cells get thinner, the mechanical stress a stiff ribbon imposes during cooling becomes a more significant cause of microcracks.
Treating a small item seriously
Because ribbon is cheap, it is often the last item planned and the first to run short. Scheduling it against line output, rather than ordering reactively, avoids an avoidable class of stoppage.
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